Dentsply Prime & Bond NT Light Cure Adhesive Sub-micron particle size for superior

Sub-micron particle size for superior polishability

SKU: 56877

High Viscosity

Breathable non-woven Fabric

easy placement in one increment up to 5mm with no additional capping layer

Dentsply Prime & Bond NT Light Cure Adhesive Sub-micron particle size for superiorPrime and Bond NT Light Cure Adhesive Description Prime & Bond NT is a light cured, total etch bonding agent that contains nanofillers of amorphous silicon dioxide, di and tri methacrylate resins, PENTA (dipentaerythritol penta acrylate monophosphate), and acetone (solvent). It requires one application followed by a 10 second light cure. Prime & Bond NT is designed to bond composite materials to enamel and dentin. It is also indicated for the bonding